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- Wafer Cutting Machine
Wafer Cutting Machine
Wafer cutting machine is a system designed for cutting wafer blocks with cream spread on by steel knives or cutting wires.
Features
- There is transparent mica on lids in order to provide safety
- Initially, wafer blocks pass through the first cutting cage, and then moved to the second cutting cage
- Easily-changed cutting mold
- There are channels for cut wastes on sides of wafer blocks
- Single or multi stowage
- Cutting with blades or wires
- Precise cutting of the wafer blocks
Related Industries
Wafer Cutting Machine is mostly used in the manufacturing of the following industry products: